On Sun, 29 May 2005 17:48:48 +0200, Robert Hedan
<
robert.hedan@...> wrote:
> Ok, so we want to make sure the temperature is spread evenly.
> What if we change approach? Instead of putting the heat onto the
> transfer,
> why not put the transfer within the heat?
> Take 2 metals plates, clamp the PCB and transfer paper between both, and
> slip the assembly into a convection oven at the desired temperature for X
> minutes?
> Robert
>
>
I think someone has tried it, look in the archives.
you need pressure, and heat, both in the right amount and right places,
and right timing.
I'm not saying a press won't work or a oven won't work, what i'm saying is
i can guarantee that a fuser or laminator will work very well.
Of course you are encouraged to experiment, only this way we learn of new
methods.
ST