JanRwl@... wrote:
> What I'd like to know about this "silver ink pen" is, does the "donut" over
> the copper pads SOLDER-over? Does the solder "wick" down-in, around the
> lead-wire? That is, if a pad of a via with NO lead-wire that is, say, under a
> 0.6 in. wide IC, is it as metallurgically-bonded to the "solder-accessible
> side" as a pad that is accessible/solderable "on top", as well?????? Jan Rowland
>
If you read the specs on the "EECO-Greenä Silver-Through-Hole" datasheet
they state max resistance is 0.1 ohm/hole and is fixed to 0.5mm
diameter. This process is obviously only suitable for a 100% SMD design
carrying signals < 1A. They also market their service as being lead
free, when standard plated through hole technology normally does not
involve any lead at all.
There is nothing wrong with wet chemistry if handled properly. I've been
plating holes at home and nothing compares to real copper inside the holes.
Adam.