--- In
Homebrew_PCBs@yahoogroups.com, "Leon Heller" <leon.heller@d...>
wrote:
>
> You should have designed the board with vias next to each of the
pads, and
> connected the top and bottom via pads with wire. Failing that you
can use
> turned-pin sockets and raise them slightly so that you can solder
the pins
> on the top and bottom of the board. That might not work with the
headers.
>
> Leon
It takes a little planning to design to handle the lack of plated
through holes. You can significantly reduce the number of vias by
making the cross layer connections at component leads where its easy.
Resistors, caps, unsocketed ICs, diodes, etc all expose their leads
on the component side and are candidates for this. It turns out (for
me anyway) that I usually only need a few vias when I apply those
"design rules".
I have heard of a technique where you insert a very thin piece of wire
in the holes where you need the cross layer connection and solder it
on the conponent side being careful not to fill the hole. Insert the
part and solder the other side. I've never done it though.