--- In
Homebrew_PCBs@yahoogroups.com, "Stefan Trethan"
<stefan_trethan@g...> wrote:
...
> Interesting too. But if you need interection between top/bottom i
prefer
> using components over
> making separate vias - kind of defeats the purpose.
> You can simply rotate the second row around (and slide, clip) to
solder it
> flat on the top layer, or
> use two single row butt-to-butt.
The problem with dual row right angle is one row is shorter than the
other so cliping is needed (as you say). Others may have better
skills than I...
I agree that if I have to make a lot of vias, might as well do TH.
However, if its only a couple, vias are preferable.
By the way, I did a destructive test on the header I tried out. Its
a stronger connection than TH. I broke it off but pieces of FR4 came
with it! Its all about surface area.