--- In
Homebrew_PCBs@yahoogroups.com, "gettingalongwouldbenice"
<gettingalongwouldbenice@y...> wrote:
...
>
> Seems like the thing to do would be to put some conformal material
between the iron and board to even out the pressure.
> High temperature thin rubber sheet?
Try children's construction paper. I'd forget the hot peel for resist
- too much of the toner will stay with the paper.
You are doing a pretty challenging board for TT. I've got a TQFP test
case somewhere that I'll dig up and try. When I used heavily coated
paper, I got too much trace bloom for it to work but with the inkjet
paper, it ought to do ok.
>
> Had another thought. What about a thin sheet of teflon.
> Print the image on that. Teflon oughta peel right off.
interesting. might even be reusable... I like the way you think.
Basically, the goal is to increase the copper/toner adhesion and/or
decrease the paper/toner adhesion.