Archive of the former Yahoo!Groups mailing list: Homebrew PCBs

Hi

Sometimes i observe the track to get thinner just where it attaches to the
pad, maybe the
last 2mm, gradually. Not often, but sometimes. It seems to be stronger
between large pads.

The reason occured to me one of these days: the higher toner area of the
pad reduces the pressure
on the track and so it spreads less.

I'm not sure if it helps to run the board twice through the fuser, in
different orientations.
One dead sure method seems to be using teardrops, which i will do from now
on.
Might be possible to eliminate with different fuser pressure / toner
density setting.

Anyone observing the same effect?
possible solutions?

ST