--- Stefan Trethan <
stefan_trethan@...> wrote:
> I feared if i use that low a current the etch may
> overcome the plating
> again.
The resistance on the rods does rise as copper plates
on to them. However, I've never had the copper content
up to the point that a rise in resistance became a
problem. Like I said, I do small runs and not large
runs that are going to saturate the solution with
copper. Besides, even if I did, an equilibrium would
be reached between copper on the rods and copper
remaining in solution: No more copper would plate out
onto the rods. But, the copper on the robs would not
be dissolved off the rods (Unless there was a decrease
in the current used to pull THAT amount of copper out
of the solution).
Regards
Marvin Dickens
=====
Registered Linux User No. 80253
If you use linux, get counted at:
http://www.linuxcounter.org__________________________________
Do you Yahoo!?
Yahoo! Photos: High-quality 4x6 digital prints for 25�
http://photos.yahoo.com/ph/print_splash