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Subject: Re: Inkjet printing to make circuit stick to substrate

From: "rmustakos" <rmustakos@...>
Date: 2004-04-06

Steve
I'm planning on puttng dry, powdered rosin and solder powder on the
board (mixed, but loose) and seeing if just printing ink on it will
make it stick together well enough so that I can blow the dry powders
off. The rosin is supposed to be hydrophilic. If this doesn't work,
I may try some type of waster based adhesive to hold it together.
I'm also trying to find some substrate that will wet enough to the
reflowed solder does not bead, but not so well that it doesn 't sheet.
I think a rough surface may be better for that then a smooth surface,
so the melted solder can wrap around the irregularities and have a
good mechanical connection.
Thanks for the Epson info!
Richard
> What method are you going to try using? Print the rosin and sprinkle
> solder on it?
>
> Steve