My last post must been sent just prior to yours.
I actually ended up completely closing up some holes with the acid copper.
It' definitely a more aggressive plate. and I suspect speed is a big
advantage to high volume. But on bigger boards, I was stressing to power the
bath for a full panel plate on 8X10 D sided board. Vie since switched to
cutting my board directly after drilling. and now only need enough for 5X4".
plus the lower requirements of flash, and I can run the tin bath from the
same rectifier (diff rheostat thou)
I found the speed of the flash copper to better suit my workflow. Just about
every part of my production, except final assembly takes about 30 mins each.
Workflow cycle is like this: ((cleaning omitted))
Phase 1 :CNC- Cut - Ink - bake
Phase 2 copper
Phase 3 Laminate, expose - develop
Phase 4 Tin
Phase 5 Strip - etch
I have between 5 and 6 boards going in rotation I'm trying to make 10
boards a day. While still having time to assemble 5 units.and work on a new
product design . . .And still work on the audio, but seems All i'm doing in
my studio these days, is these here emails.
JT
http://www.soundclick.com/jtsound ----- Original Message -----
From: "Adam Seychell" <adam_seychell@...>
To: <Homebrew_PCBs@yahoogroups.com>
Sent: Thursday, April 01, 2004 9:53 PM
Subject: Re: [Homebrew_PCBs] plated tin as the etch resist
>
>
> Jeremy Taylor wrote:
>
> > This is Solderon BHT-90 series
>
> Ok, that clears up the confusion. If you say it contains sulfuric
> but can also plate tin/lead so then the it must have some other
> electrolytes for solubility of Pb.
>