Darn, I missed the part about removal by water.
Thanks,
Steve
--- In Homebrew_PCBs@yahoogroups.com, "ballendo" <ballendo@y...> wrote:
> Hello,
>
> I read the how to use it instructions, and there appear to be a
> couple of concerns.
>
> First, it is not clearly stated but it seems that this is NOT
> a "there" or "not there" film. Rather the film is thick enough to
> resist the blast in the non-image areas, but in the "image"(means
> sandcarved) areas, there is still a thin film which must be abraded
> by the blaster. (I say this because they show no step to remove
> any "backing" film at ant point, and also because they recommend
> using a wire brush for fine detail areas, calling it a "membrane
> popper". My belief is that the membrane they refer to is the thin
> film remaining which holds everything together. Because they are not
> affixing the film to the product until AFTER exposure, developing,
> and washout...
>
> Next, the ultimate removal of the film is by placing in water. And
> that part of the instructions says that all their films are water
> soluble...
>
> Based on this, I don't think it will work well for us, if at all...
>
> Ballendo