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Subject: Re: Inkjet printing to make circuit stick to substrate

From: Richard Mustakos <rmustakos@...>
Date: 2004-03-21

Ron,
Thanks for the info. From what you said, I read that Ammonium
Chloride is useful as a flux, but will eat up non copper metals, is that
correct? I know it is very water soluble, so washing after forming the
circuit pattern on the substrate, but before soldering any components on
should get rid of the corrosion issue. Does this go along with your
understanding? I need it to perform 2 functions: absorb enough ink to
get sticky enough to hold the metals and flux to the board so I can dump
the metal and flux powders off the parts I don't need, and then to flux
the solder powder onto copper powder when I melt to the circuit onto the
substrate. When I attach the components, I can use regular solder & flux.
Thanks
Richard