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The paper kinda, sorta, gets around to mentioning silver migration at the very end. The is a very important failure mechanism for silver plated traces that have a DC voltage difference between them. The paper mentions that this occurs under specific conditions, but does not say what those conditions are. The conditions are easily met. A small potential difference between the conductors, and moisture. A film of water is not necessary, but just plain humidity. If you want to see this very dramatically, and quickly, put 5 volts between two silver plated conductors and bridge them with a drop of water. Watch under about 10X magnification. A fern like (dendritic) structure will grow out from the negative side toward the positive trace. If you don't limit the current, the the dendritic structure will "explode" when it hits the positive trace. If you limit the current enough, the short will be permanent, even after the water evaporates.
A good description is available here:
I posted a file RE silver vs gold plating for contacts. I probably shouldn't take up file space for this so i will delete the file and just supply the link.
The Performance Implications of Silver as a Contact ... - TE Connectivity
Mike N.