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Subject: Re: [Homebrew_PCBs] SMD: solder or solder paste ??

From: James <bitsyboffin@...>
Date: 2014-08-06

Solder paste is usually used only when doing reflow (reflow oven, toaster oven, frying pan, hot air...)

You can use it with a soldering iron (by placing the paste, placing the component, and touching with iron), but there's no real advantage.

A 0.4mm - 0.6mm diameter solder is just fine if you are doing SMD with a soldering iron.  My general process is to add solder to one pad, place the component with tweezers while keeping the solder molten with the iron and using the iron tip as a "stop" to help align the part, remove the iron and let the solder harden, then go do the other pad(s).  You can do this a lot faster than with through hole, a lot faster.  Extra flux is advisable when doing IC's, helps prevent bridges.



On Wed, Aug 6, 2014 at 2:27 PM, qz9090@... [Homebrew_PCBs] <Homebrew_PCBs@yahoogroups.com> wrote:
 

When soldeing SMD components it seems that one of two approaches can be used.

Note: I'm new to SMD so I may be totally off-base on this one.

It seems to me that some of you prefer to use solder paste and some of you use very small diameter, rosin filled solder. What are the pros and cons of each? Is one approach better than the other? If using solder, what diameter should one use?

Thanks.

FP