When soldeing SMD components it seems that one of two approaches can be used.
Note: I'm new to SMD so I may be totally off-base on this one.
It seems to me that some of you prefer to use solder paste and some of you use very small diameter, rosin filled solder. What are the pros and cons of each? Is one approach better than the other? If using solder, what diameter should one use?
Thanks.
FP