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Subject: Re: Thru Hole to SMD transition: How to and What to get

From: bobledoux@...
Date: 2014-07-24

I do SMT generally down to 0805, SOIC and SOT-23 size components.  In a rare case a TSSOP is soldered.

I use a Haako temperature controlled soldering station with three tip sizes that can be changed according to component needs.  The biggest tip is 1/8 wide for large through hole or heat sinked components.

Next, is a flux pen.

Then, a good pair of small non-magnetic high quality tweezers.  Nothing is more frustrating than a pair of "nonmagnetic" tweezers that won't less go of 0805 components.

A head mounted magnifier is next.

Finally, some .020 diameter lead solder.

That is all I use. 

For de-soldering I use two irons at the same time to heat both sides. 

I'd start with this list and expand it as necessary.

Chips down to SOIC size can be removed without a heat gun. Buy some Chip Quik for occasional parts removal.

If you need accurate capacitor or inductor measurements get the AADE meter.  Otherwise a basic multimeter will do.

Its easy to buy fancy stuff that is not needed or is rarely used.

Then, develop your own procedures for getting the job done.