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Subject: Re: [Homebrew_PCBs] Dry film adhesion temperature

From: Russell Shaw <rjshaw@...>
Date: 2013-12-23

On 23/12/13 23:39, James wrote:
> Does anybody actually know what the required (or recommended) adhesion
> temperature for typical negative acting dry film is?
>
> I for some reason thought it was around 70 to 80 degrees, but I've been
> experimenting with much lower temperatures (maybe 55 degrees C at the
> most) with very good results (I'm using a clothes iron to laminate it
> and the temperature is measured on the hot plate as best my thermocouple
> will).
>
> So I'm wondering what the actual necessary temperature is and how cold
> can we go before adhesion is compromised, for the clothes iron method
> the colder temperature we can use, the better, because of the danger of
> blistering the polymer with irons that are too hot.

It is commonly 100 or 110degC.

If 100degC stuff is done at 110degC it wrinkles, or blisters if there's humidity
trapped.