Markus Zingg wrote:
>
> Yes, the main advantage is that it's easier to handle. No need to
> isolate. I.e. if say at some spot there is no glue in the inner layer,
> it would not necesairly be catastrophic. It really boils down of
> applying glue to both inner layer sides, tap the outer ones on it and
> press it together as good as you manage.
>
> The inner "double sided" material is 0.5mm sized and the outer ones
> 0.3mm together with the glue you end up with something about the
> thikness of a standard PCB.
>
I was just going to say you can try making a 4 layer PCB using
two 0.8mm double sided panels and laying a piece of glass cloth
between the them. But now I've starting writing this email I
realized the added difficulty in having to etch the inner layers
separate from the outer layers. Your "three ply" technique (0.3mm
+ 0.5mm + 0.3mm) still looks like the best way.
Did you have trouble finding a supplier for single sided 0.3mm
and double sided 0.5mm board material ? I assume these are of
18um copper foil.
Adam