Well, the copper is electroplating out. Here is my
setup:
1 AMP
(-) (+)
| |
/ \
/ \
(-) (+)
| |
| |
--------------------- Top of fecl2
| |
--------- ---------
| (-) | | (+) |
| iron | | iron |
| plate | | plate |
|cathode| | anode |
--------- ---------
I'm thinking that if I adjust the ph by adding a
little hcl, the colloidal copper solids (The dirty
white lumps in the bottom of the tank) will dissolve
back into solution. I suspect this would make the
process much more efficient and faster. I'm going to
get some litmus paper and see what the ph of fresh,
unused ferric chloride is and then adjust the used
fecl3 to match it.
Best regards
Marvin Dickens
=====
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