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Subject: Re: [Homebrew_PCBs] Re: Bonding copper to FR4 core material

From: Les Newell <les.newell@...>
Date: 2012-08-16

If I remember correctly the copper is oxidized first. The oxide forms a
a slightly porous structure that allows a good bond. Layers of woven
glass cloth are impreganted with epoxy then laminated up with the
copper. The whole lot is then compressed and heated to cure the epoxy.

High temperature cure epoxy is much stronger and more heat resistant
than the cheap two part room temperature stuff you get in a local
hardware store.

Les

On 16/08/2012 15:34, David wrote:
>
>
> Thanks, John, but that link leads me only to marketing pages. I haven't been able to find any documents containing 27 or more pages. Can you point me to a link to the actual document to which you were refering?
>
> My further research leads me to understand that the copper isn't electrodeposited directly onto the core material, but is electrodeposited onto a stainless steel cylinder or drum, which is then bonded onto the uncured epoxy core. Shiny copper won't bond very well with epoxy, so I logically deduce that the copper must be treated in some way before bonding.
>
> My question remains, how is the copper sheet treated before bonding? Acid etch?
> Also, the epoxy used to make the base material seems to be more heat resistant than the common repair epoxy found in hardware stores. What kind of expoy is used to make the core material? Is it available to me as a consumer?
>
> Cheers,
> Dave M
>
>