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Subject: Re: Bonding copper to FR4 core material

From: "David" <dgminala@...>
Date: 2012-08-16

--- In Homebrew_PCBs@yahoogroups.com, "John Anhalt" <janhalt@...> wrote:
>
> See page 26 and 27 here: http://www.jjorly.com/g10_fr4_sheets_fabricator.htm Most copper is electrodeposited (i.e., plated) onto the FR4.
>
> John



>
> I would like to know how the copper sheet is prepared prior to bonding to
> the board. Anyone know?
>
> Cheers,
> Dave M
>



Thanks, John, but that link leads me only to marketing pages. I haven't been able to find any documents containing 27 or more pages. Can you point me to a link to the actual document to which you were refering?

My further research leads me to understand that the copper isn't electrodeposited directly onto the core material, but is electrodeposited onto a stainless steel cylinder or drum, which is then bonded onto the uncured epoxy core. Shiny copper won't bond very well with epoxy, so I logically deduce that the copper must be treated in some way before bonding.

My question remains, how is the copper sheet treated before bonding? Acid etch?
Also, the epoxy used to make the base material seems to be more heat resistant than the common repair epoxy found in hardware stores. What kind of expoy is used to make the core material? Is it available to me as a consumer?

Cheers,
Dave M