On Fri, 16 Mar 2012 00:38:22 -0000, you wrote:
>If Eagle has this option, I've not found it yet - doesn't mean it doesn't have it.
polygon, properties, uncheck solid fill, then the parameter for the
pattern is effective (it's not isolation).
Harvey
>
>Ken H>
>
>--- In Homebrew_PCBs@yahoogroups.com, Leon Heller <leon355@...> wrote:
>>
>> On 15/03/2012 17:21, sailingto wrote:
>> > I had wondered about the photo etch method and if it had this problem.
>>
>> It will have if you use a laser printer to create the transparencies.
>> You must use an inkjet printer.
>>
>> >
>> > The mesh method is mentioned - do you mean use a very fine mesh pattern
>> > for the solid ground plane? I'm not sure how to do this in Eagle or
>> > ExpressPCB programs. Sounds like a good idea - mesh fine enough it
>> > "looks" solid on transfer?
>>
>> It's more a "cross-hatch" pattern than a mesh, using, say, diagonal
>> lines at right angles, with something like 10/10 mil lines. The Pulsonix
>> software I use has a cross-hatch option for copper pour and power/ground
>> planes.
>>
>> Leon
>> --
>> Leon Heller
>> G1HSM
>>
>