I had wondered about the photo etch method and if it had this problem.
The mesh method is mentioned - do you mean use a very fine mesh pattern for the solid ground plane? I'm not sure how to do this in Eagle or ExpressPCB programs. Sounds like a good idea - mesh fine enough it "looks" solid on transfer?
With the normal transfer, the ground plane "looks" like it has good toner transfer - very black. BUT, on etching it doesn't look so good with many tiny holes showing.
Thanks for the suggestions and info - I might have to try photo - etching. That does seem to have better results.
Ken H>
--- In Homebrew_PCBs@yahoogroups.com, Malcolm Parker-Lisberg <mparkerlisberg@...> wrote:
>
> Use a mesh pattern, rather than solid. It happens because the electrostatic charge migrates from large areas.
>
> Malcolm
> Â
> I don't suffer from insanity I enjoy it!
> Mene, mene, tekel, upharsin
> The writing is on the wall.
>
>
> ________________________________
> From: sailingto <sailingtoo@...>
> To: Homebrew_PCBs@yahoogroups.com
> Sent: Thursday, March 15, 2012 3:15 PM
> Subject: [Homebrew_PCBs] ground planes
>
>
> Â
> Does anyone have problems getting large ground plane areas to stay good 'n solid with copper? I've been having a bit of problem with large ground plane areas using toner transfer method. If I do a board without a large ground plane, the traces look good - trace size ranges from .015" to .050" or so.
>
> I clean copper good, wash with alcohol. Toner transfer at 360ºF with a laminator using Pulsar toner transfer paper, then etch in HCl and H2O2. I used the green film last board and it seems a bit better, but not sure about large areas yet.
>
> Just checking to see if anyone else has this problem, or maybe found a solution...... or maybe it's just me?
>
> Thanks for any guidance and suggestions.
>
> Ken H>
>
>
>
>
> [Non-text portions of this message have been removed]
>