I think Harvey is saying expose, develop, and etch the top board first for
the top layer. Then do the same for the second board for the bottom layer.
Lastly glue/laminate the two boards together.
My question is, what is being used to glue the boards together? Epoxy,
repreg? Any good recommendations for a glue that is easy to spread over a
whole board, low cost, and available? Prepreg does not seem to fit the
available part.
_____
From:
Homebrew_PCBs@yahoogroups.com [mailto:
Homebrew_PCBs@yahoogroups.com]
On Behalf Of tda7000
Sent: Wednesday, February 22, 2012 12:03 AM
To:
Homebrew_PCBs@yahoogroups.comSubject: [Homebrew_PCBs] Re: Printers not making pattern opaque enough for
UV process
--- In
Homebrew_PCBs@yahoogroups.com<mailto:Homebrew_PCBs%40yahoogroups.com> , Harvey White <madyn@...> wrote:
>
> On Wed, 22 Feb 2012 02:27:45 -0000, you wrote:
>
> >Recently I had my first try at a UV-exposed board
> >
> >(because I have nightmares from trying to align paper properly for a
double-sided board with the laminator, ha ha)
> >
>
> I figured that one out, or at least, got it very close to right.
>
> use half thickness board, prepare each side individually. Make sure
> that there are three alignment holes, each at a corner, leaving out
> one corner (keeps the board from being reversed).
>
> I use map push pins and a slightly smaller drill. You want a thick
> pin so it does not get pushed side to side by misalignment.
>
> Harvey
Why half-thickness board? How do you get the board into a laminator with
push-pins in it? I am not sure I understand how this would work, can you
please explain?
[Non-text portions of this message have been removed]