Something like this may be what you need:
http://cgi.ebay.com/SMT-SMD-Solder-Paste-Adhesive-Glue-Liquid-Dispenser-EFD-/220767109957?pt=LH_DefaultDomain_0&hash=item3366bec345#ht_1230wt_907I have no experience with that specific product or seller...
-Pete
On May 7, 2011, at 1:05 PM, Boman33 wrote:
> For regular SMT assembly I use commercial stencils to screen print the
> solder paste but I am having problems dispensing solder paste by hand in
> small amounts for rework or prototypes.
>
> I have seen somewhere that individual stencils are sold but that adds the
> requirement to accurately align the stencil which will be very difficult on
> a rework board.
>
> Using a syringe and placing a single long bead across all the IC pin pads
> work fine on wider pitch ICs but as the pitch is getting smaller I am having
> trouble getting the line thin enough. In other words, there is too much
> solder so when I reflow there are solder bridging.
>
>
>
> If I use a finer tip on the syringe I cannot squeeze it hard enough for the
> paste to come out. If I add some flux it gets thinner but too runny. I
> like the normal consistency since it helps to keep the ICs in place with its
> stickiness. My current smallest bead diameter is 0.5mm (20mils). I like to
> be able to get about half of that size.
>
>
>
> I am basically looking for a solder paste with less solder and more thick
> flux material so I can squeeze out a reasonably sized bead but after reflow
> there is less solder than a normal paste.
>
> Any suggestions on a paste like that?
>
>
>
> Any other suggestions on how to place a very small amount of solder on the
> IC pads?
>
> Thanks in advance for suggestions.
>
> Bertho
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>
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