I have no personal experience. I think a plated-through-holes (PTH) process is usually a bit beyond the hobbyist level, but is the only way of achieving no-bulge vias. All other methods (eyelets, fine-gauge wire) leave protrusions on the surface that prevent flat mounting of components.
It _might_ be possible to put down a pad with a slot in the copper (extending radially from the hole) just wide enough to lay a fine gauge wire in and bridge the pad's slot and the wire with solder, producing a nearly-flat surface, but I wouldn't want to do many of those. Never mind. 1oz copper is about 0.0013 inches thick, while 30AWG wire is 0.010 inch diameter - that's about a 0.009 inch ridge on the board.
Donald.
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----- Original Message -----
> From: "Vicent Colomar Prats" <vicentecolomar@...>
> To: "Homebrew PCBs" <Homebrew_PCBs@yahoogroups.com>
> Sent: Wednesday, December 15, 2010 4:35:26 AM
> Subject: Re: [Homebrew_PCBs] Quimical VIAs
>
> Any info on double-sided metallized pads or vias?
>
> 2010/12/13 Vicent Colomar Prats <vicentecolomar@...>
>
> > Hi all,
> >
> > Does anybody know or use an affordable and easy way, from the hobby
> (not
> > professional) point of view, to create doble-sided VIAs or Pads? I
> use the
> > technique of a thin wire sodded by both sides, but it's very slow
> and I
> > can't do it under soic or tqfp pakages nor in small diametres. I use
> double
> > sided pcbs with smd 0805, and very rarely 0603, components and soic
> and tqfp
> > ics. I would like to reduce size in pcbs, but it is mandatory, for
> that
> > goal, to use very small vias under ics, but I'm not able at the
> moment.
> >
> > No matter if this is a technique, a comercial kit or a tool/machine.
> Also,
> > I can afford some hundred $$/�� in it if it is worth the job, but
> never go
> > to the thousand range. It is just hobby robotics what I do.
> >
> > Greetings.
> >
>
>
> [Non-text portions of this message have been removed]
>
>
>
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