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Subject: Re: [Homebrew_PCBs] film processing - was: Kepro FR4 presensitized laminate

From: Markus Zingg <m.zingg@...>
Date: 2003-09-29

>hi markus...
>
>i see, for hole covering it is a good method (maybe the only).
>i did know that but somehow didn't think of it....
>but you all expose the film after laminating?

Well - all - I don't know, but for me this is a must. Otherwise it
will not work.

>maybe it can be exposed by putting it into a laser printer assembly before
>lamination?

Well, never tried something like this and I highly doubht if the
laminage I use would survive the temperatures that the fixing unit of
a laser imposes. Apart of this - nice idea indeed. But then again, I
don't think that this would work out reasonably well when it comes to
double sided or multilayers because of the difficulties with
laminating this precisely enough. Laminating is a bit tricky -
especially if the envireonemental temperature goes above 30 degrees C
(86 degrees farenheit) as it happened often this summer.

>i think you know the bungard "barrel" exposure unit?
>what do you think?

No, not really. I use a home built exposure unit adn havne't looked
much around in this area. I also must say that I'm menawhile really
fully doing this the "chemical" way and so far I'm very happy. Once
you start to through hole plate, you need that many chemicals that
developing, exposing and makeing films etc. does not really matter
that much anymore. Of course I do agree that other ways could be
combined etc...

Markus