> From: "Steve Maroney" <steve@...>
> To: "Homebrew PCBs" <Homebrew_PCBs@yahoogroups.com>
> Sent: Friday, September 24, 2010 12:02:18 AM
> Subject: [Homebrew_PCBs] Trouble with through hole pads connected to plane
>
> Dear Gang,
>
Re: [Homebrew_PCBs] Trouble with through hole pads connected to plane
>
>
> I'm having quite a bit of trouble when I solder a component lead (or
> jumper wire) to a through-hole pad that is connected to a ground plane.
> When I heat the component lead/pad and begin to apply solder, the solder
> flows outwards over the plane around the pad but not to the lead and/or
> pad itself. The more solder I continue to feed in just continues to
> build up outside of the pad. Every now and then , I'll get a pad that
> the solder will stay within, but most wont.
>
>
>
> I do NOT have a single problem soldering through hole pads NOT connected
> to a plane. Anyone else have this problem and/or know what the
> solution is or what Im doing wrong ?
>
>
>
> Love this list and thanks in advance.
>
>
>
> Best Regards,
> Steve Maroney
Hello Steve, Does your PCB package Have a thermal relief setting in the copper fill function?
By using this function when doing the copper fill in PCB layout helps when soldering by stopping the heat from your soldering iron being shunted to the ground plane.
You should have various options in copper fill(also called copper pour) to select the thermal relief settings, eg. size, number of spokes, separate settings for SMD devices etc.
If your package does not have these settings check out the free DIPTrace schematic and PCB package (300 pin limit) at
http://diptrace.comHope this is of some help with your current problem, chester
[Non-text portions of this message have been removed]