Stephen Lane wrote:
the reason you remove the Photoresist is for joint high reliability when you solder the photoresist which is a plastic polymer of some sort, it degenerates to various nasties which can cause corrosion later in time this is the same reason you should wash the left over flux off the board after you have finished soldering (its often hygroscopic & again will promote eventual corrosion of your joints) however if you coat your finished assembled board with a conformal coating washing the flux isn't so critical.
Regards
Stephen
--- In Homebrew_PCBs@yahoogroups.com, "acidblue" <sunblaster5@...> wrote:
>
> I read on the MG Chemical site that it's un-necessary to tin a PCB
> if you use the photo-resist method.
>
> Here's the link
> It's #5 at the bottom of the web page
> http://www.mgchemicals.com/techsupport/proto_pos-inst.html
>
> What do you guys think?
>