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Subject: RE: [Homebrew_PCBs] Diamond saw

From: "Boman33" <boman33@...>
Date: 2010-09-03

Thanks Howard for a detailed answer.
The boards are built as an array on a Pick & Place machine and I want to cut
them apart afterwards when building prototypes.
For production they will be either scored or routed with break-off tabs.
Bertho
================================

From: Howard Chester Sent: Friday, September 03, 2010 07:34
 
>> Are there any problems running the diamond saw dry?
>> I am thinking about cutting apart finished assembled SMT boards.
>> Any vibration problems damaging components? Especially crystals?
>> Bertho

The reason the saw is used with water is to stop the diamodiferous grit on
the rim from being detached when hot. The grit is pressed into the blade rim
(usually aluminum alloy), heating causes the grit to un-bond from the rim.
Secondly, the water clears away the accumulated swarf giving a faster cut.
For all intents and purposes, keep it wet to save the blade. Unless the
board is being assembled by a manufacturer, why not cut the board before
populating it? This will alleviate any vibration problems and ingress of
water into sensitive components