Here is the second try result.
This time it covered better the via holes, especially the one in the large pads - talking about headers rows etc - 20 mils holes.
What I did:
- etch the board (toner transfer - no need to explain)
- scotch tape over
- drill (again check every hole to be clean and deburr)
- squeegee nickel print on one side then vacuum on the other
- do same on the other side (so I did both sides)
- take scotch off
- bake
- test (big holes good, small holes less than 50%)
This time I made the print more fluid (almost like ink). Indeed no big chunks anymore in the big holes (20 mils), the through vias (10 mils).. still clog. I believe the nickel it dries way too fast.
Tin plate ... TIN does not adheres to the nickel as I expected so the board looks ugly (but who cares if it works). But the same happens with solder. I think you need real copper electroplating.
Overall I think this Nickel thing is not worth the fight. Maybe Silver Print :)) ... but that is 40$ a tiny jar.
Final verdict.. this Nickel thing is getting on my nerves :)) and is messy.
I will stick for now with the copper wire soldered and then cut flush. If I am in the mood to make it look good I polish the solder joint with a soft stone to make it even more flush. This polishing thing does makes the through vias look darn nice, but you can imagine is a time killer :))
--- In Homebrew_PCBs@yahoogroups.com, DJ Delorie <dj@...> wrote:
>
> In the video tutorials I've seen of similar products, they squeegie and
> vaccum from ∗both∗ sides - first side A to side B, then side B to side A.
>