On 18/08/2010 15:00, Malcolm Parker-Lisberg wrote:
> I tried that method back in the 1980s using a product called Circuitstick and it is not worth the bother, much too fiddly and slow, difficult to get a good solder joint between via copper and pad. It does give you a through hole though. I found it much simpler to solder a thin strand of copper to the top pad insert the device and solder both on the bottom. I now just double up and provide an adjacent set of via pads where a through via is needed on a component lead.
Multicore used to sell little inserts that were pressed into the holes,
flared with a special tool, and then soldered on both sides. They are
probably still available.
Leon
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Leon Heller
G1HSM