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Subject: [EE] DIP MICRO

From: "Steve Maroney" <steve@...>
Date: 2010-07-29

I don't remember which mailing list someone recommended dipmicro
electronics as a good source for copper clad but I ordered some supplies
from them on Jul 27 and received my order today, Jul 29. Thats FAST !
They shipped via USPS from their warehouse in NY to my office in
Louisiana.

I guess most of the credit was due to USPS but at least they shipped the
same day.


http://www.dipmicro.com



Best Regards,
Steve Maroney

Business Computer Support, LLC
Mobile Phone:504-914-4704
Office Phone: 504-904-0266
Fax: 866-871-7797



-----Original Message-----
From: piclist-bounces@... [mailto:piclist-bounces@...] On Behalf
Of alan.b.pearce@...
Sent: Thursday, July 29, 2010 8:35 AM
To: piclist@...
Subject: RE: [EE] Generic SMD pad layout catalogue?

> And as I understand it (from discussions at the last SMTA event I went
> to) that the pad sizes will vary based on the height of the part (to
> vary the quantity of solder-paste applied), so two different
> 0805-footprint parts may require different pad dimensions. So far,
> I've had great success following the manufacturer's recommended
> layouts in the datasheets. I've so far not had to change the pad
> dimensions for hand soldering, but I've made pads larger if they're
> supporting a component that is expected to get hot.
>
> Cheers,
> -Neil.

Yes, that is because a 'good' joint has the solder fillet come half way
up the component metallization. So a thin component requires a lower
fillet, but the only way to get sufficient fillet on a taller component
is to have a larger pad.
--
Scanned by iCritical.

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