>From: "caveteursus" <j.walton@...>
>Reply-To: Homebrew_PCBs@yahoogroups.com
>To: Homebrew_PCBs@yahoogroups.com
>Subject: [Homebrew_PCBs] Toaster oven reflow for SMT devices
>Date: Wed, 17 Sep 2003 02:21:01 -0000
>
>motivated by the Nuts and Volts article I went out and bought a $29
>Black and Decker toaster oven, and then from Digikey some of the
>syringe solder paste ($40, you need the syringe plunger too).
>
>I am using something which appears like a dental pick to apply a
>small dab of the solder paste on the pad, then carefully place the
>device on the pads using a fine tweezer. I find it conventient to
>squeeze a bit of the paste onto the ground plane of the board.
>
>toast for a couple minutes at 450 degrees or so -- something like 2
>to 3 minutes -- the only problem seems to be that if you remove the
>board too quickly the parts can slip around a bit when the solder is
>hot.
>
In one of the web pages describing this toaster oven technique, PQFP devices
simply have a narrow 'ribbon' of paste applied across the pads. A few shorts
probably result, but are easily removed with a soldering iron.
Leon
--
Leon Heller, G1HSM Tel: +44 1424 423947
Email:
leon_heller@...My web page:
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