Hi Andrew!
I'm not sure exactly what your saying.
First, did this make sense to you?:
http://tech.groups.yahoo.com/group/Homebrew_PCBs/message/25979Basically, what I'm doing is making micro "hybrids" out of the top LCR circuitry before I commit them to bottom layer routing.
IE: a top layer 16 point(connection)circuit then becomes only 4 points of bottom layer(connections) Your PCB placement and routing software now sees the this "hybrid lump" as only 4 points of connections.
In other words, this method is not just one routing algorithm, but divided into two, a separate "top layer optimization" and a separate "bottom layer optimization".
Also, Inkjetting the "muti-layer bottom layers"(conductive and insulating) affords a unique optimization in routing in that you can now "spot mask" areas without masking the entire layer.
If you dont understand what I'm saying here, I can give you a link to my webmeeting for a audio/visual explanation of this.
--- In Homebrew_PCBs@yahoogroups.com, Andrew Villeneuve <andrewmv@...> wrote:
>
> How often can this be practical? It seems to me that the vast majority of
> signals would not happen to align with the physical pin you needed in order
> to attach components side by side. You'd need to space them out and put
> small traces.
>
> I have seen some clever IC configurations along these lines, though - I've
> once seen on a production board, SMT memory ICs literally stacked atop one
> another, all the top pins soldered directly to the bottom pins, with just
> the chip-enable and write-enable signals broken out independently.
>
> -Andrew
>
> On Tue, May 25, 2010 at 10:28 AM, Richard
> <richard.liberatoscioli@...>wrote:
>
> >
> >
> > .........Yes!
> >
> > Any RCL electronically grouped is "physically grouped" into a very tight
> > formation during the "pick and place"
> >
>
>
> [Non-text portions of this message have been removed]
>