I don't see the advantage of the flipping.
If you can print layers of conductive ink and non conductive ink then you
can just make a multilayer pcb and place the components on top. You can
just make your final pads be all connected through the lower layers with the
equivalent of blind filled vias.
I don't think the conductive ink ejects well but I'd be very curious to hear
your results.
I've found some good UV curable inks but they're not cheap and they're not
conductive.
On Thu, May 20, 2010 at 2:59 PM, Richard
<
richard.liberatoscioli@...>wrote:
>
>
>
>
> Hi James!
>
> "....difficulty getting all the components lined up at exactly the same
> height...."
>
> You lost me here ... all the SMD's lay in flat down against the flat
> surface of the substrate, easily keeping all the SMD's at the same level.
>
>
> --- In Homebrew_PCBs@yahoogroups.com <Homebrew_PCBs%40yahoogroups.com>,
> "richard.liberatoscioli" <richard.liberatoscioli@...> wrote:
> >
> >
> >
> > --- In Homebrew_PCBs@yahoogroups.com <Homebrew_PCBs%40yahoogroups.com>,
> "James" <jamesrsweet@> wrote:
> > >
> > > I think you would have difficulty getting all the components lined up
> at exactly the same height and making reliable connections. It would be
> interesting to try but if I were trying to make something so complex I'd
> have a batch of boards made.
> > >
> >
>
>
>
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