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Subject: Re: Old GL FeCl -very slow etching copper

From: "James" <jamesrsweet@...>
Date: 2010-05-19

--- In Homebrew_PCBs@yahoogroups.com, "Frank P" <qz9090@...> wrote:
>
> James,
> I believe you need to introduce oxygen into the etchant (air bubbles) to increase the effectiveness of the etching process. If you look at some of the "how-to"s in the Links section of the Group, you might get some ideas.
>
> It seems that the following affect the results:
> 1) air bubbles
> 2) temperature
> 3) HCl to hydrogen peroxide mix
>
> I'm just beginning to investigate the use of CuCl, so the information I have provided is based on my research on the Links page and on the Internet.
>
>

I could probably benefit from more air and finer bubbles. I do have a bubbler set up in my tank but the bubbles are a bit large and I have trouble getting them distributed evenly. I get good results by heating the solution though so there's no urgent reason to change the process.