--- In
Homebrew_PCBs@yahoogroups.com, Henry Liu <henryjliu@...> wrote:
>
> I have done some detailed thinking about fastest assembly for prototypes.
>
> I have still yet to find something better than Zeph paste in a syringe
> + hot air. There's a video here for a QFP:
> http://www.zeph.com/zephpaste.htm
>
> Hot Air Operations:
> i) Paste 4 sides of chip, 10seconds per side
>
> Total Time: 40 seconds and no cleanup.
Fast!
I guess it is a style decision for them to use that shape of base for everything, but it sure does seem excessive for the vacuum pick-and-place.
Simple enough to build the pre-heater. I don't see this system working well for BGA reflowing, unless that hot air tip can put out a lot more heat than it looks like it can.
Someone gave me an Xbox with the red-ring-of-death, you see...
Steve Greenfield