"jimofc300" <
jim@...> writes:
> I was told here that I didn't use enough laminator passes.
Not enough heat. I run my laminator about 20 degrees hotter than the
default.
> Questions to hopefully avoid more errors: Has anyone tried the Direct
> Etch method?
Yes, and it works just fine. What I did was half-fill a large
container with hot tap water, and put my FeCl container in it when I
started the lamination. By the time it was time to etch, the FeCl was
warm/hot without being too hot, and between that and the sponge it
took 45 seconds to etch 0.5 oz copper.
I ∗do∗ use a tray with this technique, though. Pour the FeCl into the
tray, hold the pcb over it, and dip the sponge into the etchant every
once in a while to freshen it. For the tray, I used half of a gallon
milk jug (the left half, with the handle and spout still intact so you
can use it to pour the etchant back into the bottle).