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Subject: Re: [Homebrew_PCBs] Re: etch resist as solder mask

From: DJ Delorie <dj@...>
Date: 2010-01-12

"David B" <davidlbarber@...> writes:
> > I was expecting problems when the pcb got to the rollers, but it got
>
> Try cold rolling through the laminator first. I find this pushs the
> air out before hot laminating.

The discovery isn't about air bubbles, it's about getting 1/16" PCBs
to ∗fit∗ into the laminator. If I hold the end of the film up as it's
entering, I usually don't have problems with air bubbles. ∗Steam∗
bubbles are a different story - but laminating below 212F seems to
solve that problem.