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Subject: Re: [Homebrew_PCBs] Dry film tenting problem & pattern plating

From: Stefan Trethan <stefan_trethan@...>
Date: 2010-01-08

I didn't understand what you are saying there. Anyway I made it plenty
clear that my information about this etchant is very thin indeed.

ST

On Fri, Jan 8, 2010 at 1:47 PM, Simao Cardoso <simaocardoso@...> wrote:
> Volkan Sahin wrote:
>
>>
>> It seems peroxy-sulfuric etcher won't etch tin etch resist and it is
>> possible to obtain  stabilizer  from think&tinker in low volume.
>
>
>
> I don't know why Stefan Trethan says that, i also said lots of very
> wrong things in here already, but is really bad when we induce people in
> mistake.
>
> The peroxy-sulfuric will etch tin without additives. The stabilizer is
> for the 35% - 50% hydrogen peroxide don't decompose in explosion when
> you put a copper board in there.
>
> I also wish to use a sulfuric based etchant but not like this.
> Did you read the patents i mentioned?
>
>
>