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Subject: Re: [Homebrew_PCBs] Dry film tenting problem & pattern plating

From: Simao Cardoso <simaocardoso@...>
Date: 2010-01-07

Volkan Sahin wrote:

>
> I'm facing dry film tenting problems.

Increase pad anular ring. Ugly but works.

> tin or nickel etch resist?

Dont go with nickel. It seems cheap and will be great to immersion gold
finish but it don't resist in CuCl and since you have to use a complex
etchant you should avoid the boric acid in the nickel plating setup.