On 16 Dec 2009 17:18:49 -0500, you wrote:
>
>Harvey White <madyn@...> writes:
>> Just solder making the connection between layers is not a good idea.
>> If the connection is from a trace to a pit (what would be a blind via,
>> not all the way through), I'd use a wire and solder it.
>>
>> If the connection is through a board (full via) connecting top and
>> bottom layers, solder is not the way to go. There's no way to
>> guarantee that the solder flows down into the hole and makes the
>> connection.
>
>Having tried these, I can pretty much guarantee that the solder will
>∗not∗ go down the hole, or into the pit, or whatnot. Way too much
>surface tension.
Yep, not a good idea. Doesn't work.
>
>> The solder that helps hold them in place can wick down the wire, but
>> is not the prime connection.
>
>In my experience, it doesn't wick down the wire into the hole. You've
>seen it happen with ∗plated∗ holes, but without plating, it just stays
>at the surface.
>
No plated through holes, you have a problem making connections. I've
used eyelets, but those get filled (and perhaps overfilled) with
solder. Main thing is to make sure that the eyelet has sufficient pad
around it to make a good connection. Ditto with feedthrough wires.
You need to lace the wire through the board, then solder. Otherwise,
you solder the wire and it drops out on the second side. Awkward at
best.
Harvey
>
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