Harvey White <
madyn@...> writes:
> Just solder making the connection between layers is not a good idea.
> If the connection is from a trace to a pit (what would be a blind via,
> not all the way through), I'd use a wire and solder it.
>
> If the connection is through a board (full via) connecting top and
> bottom layers, solder is not the way to go. There's no way to
> guarantee that the solder flows down into the hole and makes the
> connection.
Having tried these, I can pretty much guarantee that the solder will
∗not∗ go down the hole, or into the pit, or whatnot. Way too much
surface tension.
> The solder that helps hold them in place can wick down the wire, but
> is not the prime connection.
In my experience, it doesn't wick down the wire into the hole. You've
seen it happen with ∗plated∗ holes, but without plating, it just stays
at the surface.