Alexis Shaw wrote:
>
> I think that in order to do 3 oz one must use semi-additive etching.
> that is put doen the photoresist and then electrroplate, strip the
> resist and etch the whole board.
You mean Negative print the resist, copper pattern plating up to 105µm,
metallic resist plating, resist stripping, metallic resist compatible
etchant and metallic resist strip?
Milling the board seems much better!
I thought it could be done with 1 step etching since some processes used
in metal engraving seems very similar to pcb etching.