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Subject: Re: [Homebrew_PCBs] Eagle help with making pads thicker

From: Ehab Anwar <flik.80@...>
Date: 2009-11-19

hi

to make the pads bigger, edit the foot print in the library
to do this flow the steps

1- from the control panel go to (file ---> open ---> library)
2- select your library
3- from the tool bar use the package batten
4- select the component you wont to edit
5- from the action tool bar use chang ---> diameter




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Ehab Anwar

+2 010 769 7744

Skype : flik.80

http://ehabanwar.freevar.com/
http://dhost.info/bdrelectronics

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2009/11/19 billshat44 <billshat44@...>

>
>
> I spent the last hour reviewing old threads about tt and have a question
> about making component pads thicker using Eagle. The process I use is design
> the board using Eagle and print the board on Staples Basic Photo paper. I
> prepare my copper board using a kitchen scratching pad, then rinse and dry.
> I actually use a iron used for ironing monocoat on airplanes. It heats up
> well over 300 degrees and it is easier to see where you are ironing. I iron
> for around 4 to 5 minutes, cool the board with cold water and peel the paper
> off. The paper comes off with minimal effort under running water. Usually
> the board looks very good, except for the fact that I lose about 10 percent
> of the pads. I get a half moon on the pad, but not good crisp circles. I
> think the thickness of the pads is too small. What I would like to do is to
> make the pads thicker (Between the hole and outer edge, sorry I don't know
> the terminology). What is the best way to make the pads bigger (Thicker)
> Thanks. Carroll
>
>
>


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