But this is the step after developing, done with water, not developer.
To me it seems the resist will turn into gunk in the developer even
without much agitation, and that gunk is washed away in the next step?
ST
On Sun, Sep 13, 2009 at 11:50 AM, Adam Seychell <a_seychell@...> wrote:
>
> All the data sheets I've read have only mentioned developing with spray.
> In my experience the resist simply does not wash away with simple
> immersion or bubble agitation.
>
> From the data sheet http://www.dryfilmresist.com/pds/kg5100.pdf
>
> "To affectively clean between circuit traces to remove all developing
> residue, the panels must be throughly rinsed
> with water at temperatures ranging from 15 to 30℃ (59-86F) and pressures
> greater than 1.4 bar(20psi). Poor
> rinsing may promote ragged edges, rough plating, step plating, resist
> lifting. Rinsing is a most important part of
> the developing process."
>
> Adam
>