I don't think sharp and fast heating are the correct terms. It is
rather more gradual with preheat to give moisture the chance to gas
out and stuff. The profiles can be found easily, but apart from a
restriction on how long you should stay over a certain temperature
(longer and the solder may start to dissolve the metallized film
terminations on chip components) there is usually a restriction given
how _slow_ you have to increase the heat.
ST
On Tue, Aug 18, 2009 at 12:11 AM, juanabba<jjose.2008@...> wrote:
> Hi Phil
>
>
> some time ago I visited a large SMD assembly house,
> and I remember the guy touring us mentioning that the ovens
> ( quite a few 3 metters long ) were the card is soldered when
> traveling inside it, has a totally controlled, very sharp and
> fast heating and latter cooling, that should follow some rigid
> temperature curves in order to preserve the components.
>
> I am looking for this information before deciding to go on on the project.
>
> regards
>
> jjose
>
>
>
>