"lcdpublishing" <
lcdpublishing@...> writes:
> TO clarify, using the dry film type stuff, I would get blisters -
If you lay the film flat on the pcb and run it through the laminator,
you're going to get blisters. You've got to either get the air out
ahead of time (Adam's wet method) or keep the film OFF the pcb until
the laminator presses it down (my method).
Details of my method:
I flip the PCB over and lay the film next to it, with a 1/2 inch
overlap, and press the overlap part down. Now I flip the PCB over and
fold the film along the attached edge. Feed the attached edge into
the laminator and IMMEDIATELY grab the other two corners of the film
and peel it off the PCB. Pull gently away from the laminator, and
apart, to keep the film smooth, and pull up some to keep it off the
pcb. You want the film's first contact with the PCB to be at the
laminator's roller, so that no air bubbles are trapped.