I've always just had someone else make/assemble a surface mount board
whenever I needed it for work (being a theorist means you don't do
that much real work) but I'm interested in building my own now.
I read the following articles:
http://www.sparkfun.com/commerce/tutorial_info.php?tutorials_id=59http://www.sparkfun.com/commerce/tutorial_info.php?tutorials_id=58and want to try the skillet method.
The paste stenciling seems geared toward faster production. Is it
possible to just get a syringe and dab a small amount of solder paste
to each pad without getting a stencil / squeegee for experiments/1 off
boards or do you need a stencil to reflow?
I've always just used through hole components whenever prototying my
own boards and hand soldered the smt. This led to a few things:
1) I spend way too much time minimizing discrete resistors/caps
because I hate soldering them
2) I hate hand soldering smt even more so I minimize their use
Hopefully if I get the smt to work it seems it's much easier to use
lots of smt discrete components as you just lay them on top and it
solders itself.
Any tips would be appreciated. Thanks!