"sailingto" <
sailingto@...> writes:
> Bragging aren't you?
Yes, and sharing how I got there so others can benefit.
> I just looked at the photos - and you have something to brag about -
> CONGRATS, good job.
Thanks! I think 6/6 is my limit though. I need a 4 mil hole to etch
a 6 mil gap reliably, and 3 mil holes leave some shorts. I could
probably do some 5/5 as needed on a board, though.
> Maybe someday I'll move "up to" photo resist etching. For now, the
> GBC laminator and the HP P1006 printer seem to be doing a good job.
I still use TT when appropriate. I think the temperature control on
the laminator is a big help in getting predictable results there, too.
But you do need a UV source and two more chemical tanks, although the
chemicals are cheap.
Oh, this is with the MG Chemicals film, even with Na2CO3 developer
(they "require" K2CO3).
I came to a TT realization last night. I realized that the outer PCB
layers I use are thin enough to see though - I can laminate on the TT
silk layer and align it by looking through the ∗pcb∗, not by looking
through the ∗paper∗. Now I think crosshairs on the silk where the
larger holes are would let me see through even thicker pcbs to line up
the silk layer.